ood packaging clearances for direct food contact using UV and EB materials such as coatings, adhesives and inks are being pursued by members of RadTech. “The fast growing and already wide use of UV and EB in the package converting industry is fringing this initiative,” said David Diehl of PPG and president of RadTech. “While thermally-cured solvent and waterborne systems have been used by the food packaging industry for many years, there are virtually no basic components that have been listed as yet by the FDA for the relatively recent strong emergence of UV and EB inks, adhesive and coating formulations.”
Nearly 50 RadTech members attended the first planning meeting for the initiative, with the group forming the FDA Food Packaging Alliance. The law firm of Keller and Heckman, Washington D.C., has been retained to administer the initiative. For more information e-mail Radtech at [email protected]; web: www.radtech.org.